Wafer Lapping Machine Special Attachment from Germany
Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify surface flatness specs (e.g
• <1 micron) to match statistical note criteria
• Use HTSUS advisory rulings for complex lapping/polishing combos