</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8466.30.60.85/Wafer Lapping Machine Special Attachment/Canada

Wafer Lapping Machine Special Attachment from Canada

Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.

Duty Rate — Canada → United States

12.9%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Calculate with your customs valueVerify classification with AI

Import Tips

• Certify surface flatness specs (e.g

• <1 micron) to match statistical note criteria

• Use HTSUS advisory rulings for complex lapping/polishing combos