Wafer Grinder Flange Holder from Japan
Custom flange holder attachment securing wafers during back-grinding to target thickness in semiconductor prep. Falls under HTS 8466.30.60.85 for grinder special attachments in statistical note (b)(ii)(C).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify vacuum chuck compatibility for classification support
• Document prevents shift to general 8466.10 self-opening holders
• Validate with CBP for 8-digit statistical suffix accuracy