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8466.30.60.85/Wafer Grinder Flange Holder/Japan

Wafer Grinder Flange Holder from Japan

Custom flange holder attachment securing wafers during back-grinding to target thickness in semiconductor prep. Falls under HTS 8466.30.60.85 for grinder special attachments in statistical note (b)(ii)(C).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify vacuum chuck compatibility for classification support

• Document prevents shift to general 8466.10 self-opening holders

• Validate with CBP for 8-digit statistical suffix accuracy

Wafer Grinder Flange Holder from Japan — Import Duty Rate | HTS 8466.30.60.85