Semiconductor Wafer Slicing Saw Tool Holder from Japan
Special tool holder attachment for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It qualifies for HTS 8466.30.60.85 as a special attachment for machines in wafer preparation under statistical note (b)(ii)(B).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document saw blade tolerances and wafer thickness specs to confirm classification
• Avoid common error of classifying with general saw blades under 8202; must prove principal use with 8456-65 machines
• Obtain BIS export control checks if dual-use tech applies to semiconductor fab equipment