Semiconductor Wafer Slicing Saw Tool Holder from Germany
Special tool holder attachment for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It qualifies for HTS 8466.30.60.85 as a special attachment for machines in wafer preparation under statistical note (b)(ii)(B).
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document saw blade tolerances and wafer thickness specs to confirm classification
• Avoid common error of classifying with general saw blades under 8202; must prove principal use with 8456-65 machines
• Obtain BIS export control checks if dual-use tech applies to semiconductor fab equipment