Semiconductor Wafer Slicing Saw Tool Holder from China
Special tool holder attachment for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. It qualifies for HTS 8466.30.60.85 as a special attachment for machines in wafer preparation under statistical note (b)(ii)(B).
Duty Rate — China → United States
40.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document saw blade tolerances and wafer thickness specs to confirm classification
• Avoid common error of classifying with general saw blades under 8202; must prove principal use with 8456-65 machines
• Obtain BIS export control checks if dual-use tech applies to semiconductor fab equipment