8466.30.60.85/Semiconductor Wafer Polisher Dividing Head/Mexico

Semiconductor Wafer Polisher Dividing Head from Mexico

Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.

Duty Rate — Mexico → United States

12.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Provide polish RMS roughness data to substantiate wafer prep classification

• Avoid misdeclaration as consumer polishers under 8460 without semi-specific docs

• Check for anti-dumping on Asian polishing attachments

Semiconductor Wafer Polisher Dividing Head from Mexico — Import Duty Rate | HTS 8466.30.60.85