Semiconductor Wafer Polisher Dividing Head from Mexico
Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.
Duty Rate — Mexico → United States
12.9%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide polish RMS roughness data to substantiate wafer prep classification
• Avoid misdeclaration as consumer polishers under 8460 without semi-specific docs
• Check for anti-dumping on Asian polishing attachments