Semiconductor Wafer Polisher Dividing Head from Japan
Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide polish RMS roughness data to substantiate wafer prep classification
• Avoid misdeclaration as consumer polishers under 8460 without semi-specific docs
• Check for anti-dumping on Asian polishing attachments