Semiconductor Wafer Polisher Dividing Head from Germany
Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide polish RMS roughness data to substantiate wafer prep classification
• Avoid misdeclaration as consumer polishers under 8460 without semi-specific docs
• Check for anti-dumping on Asian polishing attachments