Semiconductor Wafer Polisher Dividing Head from China
Rotary dividing head for wafer polishers that achieve mirror-finish surfaces on semiconductor wafers prior to device fabrication. Classified in HTS 8466.30.60.85 for special attachments on polishing machines per statistical notes.
Duty Rate — China → United States
40.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide polish RMS roughness data to substantiate wafer prep classification
• Avoid misdeclaration as consumer polishers under 8460 without semi-specific docs
• Check for anti-dumping on Asian polishing attachments