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8466.30.60.85/Monocrystalline Boule Slicer Arbor Attachment/Japan

Monocrystalline Boule Slicer Arbor Attachment from Japan

Arbor attachment for high-precision slicing saws converting semiconductor boules into wafers with minimal kerf loss. HTS 8466.30.60.85 applies as special attachment for wafer manufacturing equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include diamond wire specs if applicable for inner-diameter saw classification

• EAR compliance mandatory for wafer fab tooling

Monocrystalline Boule Slicer Arbor Attachment from Japan — Import Duty Rate | HTS 8466.30.60.85