Monocrystalline Boule Slicer Arbor Attachment from Japan
Arbor attachment for high-precision slicing saws converting semiconductor boules into wafers with minimal kerf loss. HTS 8466.30.60.85 applies as special attachment for wafer manufacturing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include diamond wire specs if applicable for inner-diameter saw classification
• EAR compliance mandatory for wafer fab tooling