Monocrystalline Boule Slicer Arbor Attachment from Germany
Arbor attachment for high-precision slicing saws converting semiconductor boules into wafers with minimal kerf loss. HTS 8466.30.60.85 applies as special attachment for wafer manufacturing equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include diamond wire specs if applicable for inner-diameter saw classification
• EAR compliance mandatory for wafer fab tooling