Monocrystalline Boule Slicer Arbor Attachment from Germany
Arbor attachment for high-precision slicing saws converting semiconductor boules into wafers with minimal kerf loss. HTS 8466.30.60.85 applies as special attachment for wafer manufacturing equipment.
Duty Rate — Germany → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include diamond wire specs if applicable for inner-diameter saw classification
• EAR compliance mandatory for wafer fab tooling