Wire Saw for Silicon Wafers from Mexico
Multi-wire slurry saw for simultaneously slicing hundreds of silicon wafers from ingots, statistical note compliant equipment. HTS 8465.96.0051 slicing machine for semiconductor hard materials. Achieves 40-60μm kerf loss for maximum yield.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail wire diameter, tensioning system, and ingot size range (156-210mm squared) for accurate duty
• Include wire consumption rate and slurry system specs in technical data