Wire Saw for Silicon Wafers from Germany
Multi-wire slurry saw for simultaneously slicing hundreds of silicon wafers from ingots, statistical note compliant equipment. HTS 8465.96.0051 slicing machine for semiconductor hard materials. Achieves 40-60μm kerf loss for maximum yield.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Detail wire diameter, tensioning system, and ingot size range (156-210mm squared) for accurate duty
• Include wire consumption rate and slurry system specs in technical data