Wire Saw for Silicon Wafers from Canada
Multi-wire slurry saw for simultaneously slicing hundreds of silicon wafers from ingots, statistical note compliant equipment. HTS 8465.96.0051 slicing machine for semiconductor hard materials. Achieves 40-60μm kerf loss for maximum yield.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Detail wire diameter, tensioning system, and ingot size range (156-210mm squared) for accurate duty
• Include wire consumption rate and slurry system specs in technical data