8465.96.00.51/Wafer Grinder for Backside Thinning/Mexico

Wafer Grinder for Backside Thinning from Mexico

Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.

Duty Rate — Mexico → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document temporary bonding/debonding compatibility and grind thickness range (20-100μm)

• Avoid reclassification to 8486 if used pre-device processing

• Include stress relief grinding wheel specs for warpage control

Wafer Grinder for Backside Thinning from Mexico — Import Duty Rate | HTS 8465.96.00.51