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8465.96.00.51/Wafer Grinder for Backside Thinning/Mexico

Wafer Grinder for Backside Thinning from Mexico

Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.

Duty Rate — Mexico → United States

12.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Document temporary bonding/debonding compatibility and grind thickness range (20-100μm)

• Avoid reclassification to 8486 if used pre-device processing

• Include stress relief grinding wheel specs for warpage control

Wafer Grinder for Backside Thinning from Mexico — Import Duty Rate | HTS 8465.96.00.51