Wafer Grinder for Backside Thinning from Germany
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document temporary bonding/debonding compatibility and grind thickness range (20-100μm)
• Avoid reclassification to 8486 if used pre-device processing
• Include stress relief grinding wheel specs for warpage control