Wafer Grinder for Backside Thinning from Canada
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document temporary bonding/debonding compatibility and grind thickness range (20-100μm)
• Avoid reclassification to 8486 if used pre-device processing
• Include stress relief grinding wheel specs for warpage control