Wafer Grinder for Backside Thinning from Canada
Precision grinder temporarily bonded wafers to <50μm thickness for 3D IC packaging, semiconductor wafer preparation equipment. HTS 8465.96.0051 as grinding machine for hard materials. Maintains 95% die strength post-grind.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document temporary bonding/debonding compatibility and grind thickness range (20-100μm)
• Avoid reclassification to 8486 if used pre-device processing
• Include stress relief grinding wheel specs for warpage control