Wafer Edge Grinding Machine from Japan
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document wafer thickness range (50-775μm) and material (Si/Ge) to prove semiconductor classification
• Avoid pitfall of classifying as general lapping/polishing under 8464 if edge-specific functionality emphasized
• Include cleanroom certification (ISO 3-5) in paperwork for fab compatibility