Wafer Edge Grinding Machine from China
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Duty Rate — China → United States
22.4%
Rate breakdown
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document wafer thickness range (50-775μm) and material (Si/Ge) to prove semiconductor classification
• Avoid pitfall of classifying as general lapping/polishing under 8464 if edge-specific functionality emphasized
• Include cleanroom certification (ISO 3-5) in paperwork for fab compatibility