Wafer Edge Grinding Machine from Canada
Automated grinder for profiling and chamfering edges of semiconductor wafers to prevent chipping during handling and processing. Meets HTS 8465.96.0051 as paring/slicing equipment for hard semiconductor materials post-slicing. Critical for achieving flatness tolerances in wafer preparation.
Duty Rate — Canada → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wafer thickness range (50-775μm) and material (Si/Ge) to prove semiconductor classification
• Avoid pitfall of classifying as general lapping/polishing under 8464 if edge-specific functionality emphasized
• Include cleanroom certification (ISO 3-5) in paperwork for fab compatibility