Semiconductor Wafer Slicing Saw from Japan
High-precision saw for slicing ultra-thin wafers from monocrystalline semiconductor boules like silicon or gallium arsenide, per statistical notes on wafer slicing saws. Falls under HTS 8465.96.0051 as a slicing machine for hard materials in semiconductor processing. Ensures minimal kerf loss and precise wafer thickness for device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include boule material compatibility specs (Si, GaAs) in import docs; misclassification to Chapter 90 testing equipment is common
• Obtain advance ruling on 'semiconductor-specific' features to confirm 8465 vs 8486 classification
• Check for diamond wire or blade tech compliance with US safety standards for high-precision slicing