8465.96.00.51/Sapphire Wafer Slicer/Mexico

Sapphire Wafer Slicer from Mexico

Laser or diamond saw for slicing synthetic sapphire substrates used in LED/GaN semiconductor devices. HTS 8465.96.0051 slicing hard materials for semiconductor applications. Handles 2-4 inch boules with <5μm TTV.

Duty Rate — Mexico → United States

12.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify synthetic sapphire boule processing vs natural gemstone cutting

• Include GaN/LED substrate end-use documentation

• Document laser wavelength for c-plane/r-plane sapphire cutting

Sapphire Wafer Slicer from Mexico — Import Duty Rate | HTS 8465.96.00.51