Sapphire Wafer Slicer from Mexico
Laser or diamond saw for slicing synthetic sapphire substrates used in LED/GaN semiconductor devices. HTS 8465.96.0051 slicing hard materials for semiconductor applications. Handles 2-4 inch boules with <5μm TTV.
Duty Rate — Mexico → United States
12.4%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify synthetic sapphire boule processing vs natural gemstone cutting
• Include GaN/LED substrate end-use documentation
• Document laser wavelength for c-plane/r-plane sapphire cutting