Polycrystalline Silicon Chunk Sizer from Japan
Grinding/sizing machine for polysilicon chunks before Czochralski growth, upstream semiconductor material processing. HTS 8465.96.0051 as paring equipment for hard semiconductor materials. Ensures uniform feedstock for crystal growth.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document 9N-11N purity handling capability distinguishing from metallurgical silicon
• Include chunk size range (10-100mm) and contamination control specs