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8465.96.00.51/Polycrystalline Silicon Chunk Sizer/Japan

Polycrystalline Silicon Chunk Sizer from Japan

Grinding/sizing machine for polysilicon chunks before Czochralski growth, upstream semiconductor material processing. HTS 8465.96.0051 as paring equipment for hard semiconductor materials. Ensures uniform feedstock for crystal growth.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Document 9N-11N purity handling capability distinguishing from metallurgical silicon

• Include chunk size range (10-100mm) and contamination control specs

Polycrystalline Silicon Chunk Sizer from Japan — Import Duty Rate | HTS 8465.96.00.51