Polycrystalline Silicon Chunk Sizer from Germany
Grinding/sizing machine for polysilicon chunks before Czochralski growth, upstream semiconductor material processing. HTS 8465.96.0051 as paring equipment for hard semiconductor materials. Ensures uniform feedstock for crystal growth.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document 9N-11N purity handling capability distinguishing from metallurgical silicon
• Include chunk size range (10-100mm) and contamination control specs