Gallium Arsenide Wafer Paring Tool from Japan
Precision paring machine for trimming GaAs compound semiconductor wafers to exact dimensions after slicing. Covered under HTS 8465.96.0051 for paring hard semiconductor materials per statistical notes. Handles brittle III-V materials without subsurface damage.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide GaAs-specific process parameters (low force, high precision) distinguishing from silicon equipment
• Ensure classification differentiates from optical glass paring under 8465.91
• Include toxicity handling certifications for arsenic compounds in import declaration