Gallium Arsenide Wafer Paring Tool from Germany
Precision paring machine for trimming GaAs compound semiconductor wafers to exact dimensions after slicing. Covered under HTS 8465.96.0051 for paring hard semiconductor materials per statistical notes. Handles brittle III-V materials without subsurface damage.
Duty Rate — Germany → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide GaAs-specific process parameters (low force, high precision) distinguishing from silicon equipment
• Ensure classification differentiates from optical glass paring under 8465.91
• Include toxicity handling certifications for arsenic compounds in import declaration