Crystal Boule Diameter Grinder from Japan
Machine for grinding semiconductor crystal boules to precise diameter tolerances before slicing, creating orientation flats per statistical note (a)(ii)(A). HTS 8465.96.0051 as grinding/paringsplitting equipment for hard materials. Critical for uniform wafer yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flat positioning accuracy (±0.5°) and diameter tolerance (±0.1mm) for classification support
• Include Czochralski/float-zone boule compatibility in technical literature