Crystal Boule Diameter Grinder from Japan
Machine for grinding semiconductor crystal boules to precise diameter tolerances before slicing, creating orientation flats per statistical note (a)(ii)(A). HTS 8465.96.0051 as grinding/paringsplitting equipment for hard materials. Critical for uniform wafer yield.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flat positioning accuracy (±0.5°) and diameter tolerance (±0.1mm) for classification support
• Include Czochralski/float-zone boule compatibility in technical literature