Crystal Boule Diameter Grinder from China
Machine for grinding semiconductor crystal boules to precise diameter tolerances before slicing, creating orientation flats per statistical note (a)(ii)(A). HTS 8465.96.0051 as grinding/paringsplitting equipment for hard materials. Critical for uniform wafer yield.
Duty Rate — China → United States
19.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.157.5%Except as provided in headings 9903.88.39, 9903.88.42, 9903.88.44, 9903.88.47, 9903.88.49, 9903.88.51, 9903.88.53, 9903.88.55, 9903.88.57, 9903.88.65, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(r) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(s)
Import Tips
• Document flat positioning accuracy (±0.5°) and diameter tolerance (±0.1mm) for classification support
• Include Czochralski/float-zone boule compatibility in technical literature