Crystal Boule Flattener
Machine that grinds flats on semiconductor crystal boules to encode crystal orientation and doping information. Per statistical notes, classified as wafer preparation equipment under HTS 8464.90.0120 for mineral-like processing. Standard in silicon foundries.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If for stone/ceramic surface planning, not semiconductor
Planers for general mineral materials vs. statistical note specifics.
If part of automated boule handling system
Semiconductor production machines for materials handling.
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Import Tips & Compliance
• Document flat positioning standards (e.g
• ASTM) for classification support
• Cleanroom compatibility certification speeds customs clearance
Related Products under HTS 8464.90.01.20
Czochralski Crystal Puller
A machine tool used to produce monocrystalline silicon boules by pulling a seed crystal from molten silicon in a vacuum chamber, grinding the boule to precise diameter for wafer production. Classified under HTS 8464.90.0120 as it functions as a grinder for semiconductor crystal ingots, akin to mineral material processing. Essential for semiconductor wafer manufacturing.
Gallium Arsenide Boule Grinder
Specialized grinder for GaAs compound semiconductor boules, achieving dimensional tolerances for wafer production. Classified in 8464.90.0120 as processing semiconductor materials like ceramics/minerals. Handles brittle III-V materials requiring diamond tooling.
Diamond Wafer Lapper
Lapping machine using diamond slurry to achieve flatness tolerances on semiconductor wafers before polishing. HTS 8464.90.0120 covers wafer grinders/lappers/polishers as mineral material working tools per notes. Prepares wafer surface for device fabrication.
SiC Wafer Grinder
Grinder for silicon carbide (SiC) power semiconductor wafers, handling extreme hardness of ceramic-like material. Fits HTS 8464.90.0120 as processing ceramics/minerals for semiconductor use. Enables high-voltage device production.
Sapphire Wafer Back Grinder
Backside grinder for sapphire (Al2O3) substrates used in LED/GaN semiconductors, thinning wafers to device specs. HTS 8464.90.0120 as cold working glass-like mineral materials. Key for optoelectronics.
Silicon Ingot Grinder
Precision grinder that shapes semiconductor silicon ingots to exact diameters and flats indicating conductivity type, preparing them for wafer slicing. Falls under HTS 8464.90.0120 per statistical notes as crystal grinders for semiconductor materials treated like mineral processing tools. Critical step in wafer preparation.