Silicon Wafer Lapping Machine from Japan
Lapping equipment for semiconductor wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication, covered under statistical note (a)(ii)(C) for wafer preparation. HTS 8464.20.0120 applies as a grinding/polishing machine for mineral semiconductor materials. Critical for ensuring wafer flatness in chip production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include process flow diagrams showing lapping for semiconductor wafer flatness; label as 'wafer preparation equipment' per statistical notes; watch for anti-dumping duties on precision grinding machinery