Silicon Wafer Lapping Machine from Germany
Lapping equipment for semiconductor wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication, covered under statistical note (a)(ii)(C) for wafer preparation. HTS 8464.20.0120 applies as a grinding/polishing machine for mineral semiconductor materials. Critical for ensuring wafer flatness in chip production.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include process flow diagrams showing lapping for semiconductor wafer flatness; label as 'wafer preparation equipment' per statistical notes; watch for anti-dumping duties on precision grinding machinery