Silicon Wafer Lapping Machine from China
Lapping equipment for semiconductor wafers that achieves ultra-flat surfaces within tight dimensional tolerances before fabrication, covered under statistical note (a)(ii)(C) for wafer preparation. HTS 8464.20.0120 applies as a grinding/polishing machine for mineral semiconductor materials. Critical for ensuring wafer flatness in chip production.
Duty Rate — China → United States
37%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include process flow diagrams showing lapping for semiconductor wafer flatness; label as 'wafer preparation equipment' per statistical notes; watch for anti-dumping duties on precision grinding machinery