Gallium Arsenide Wafer Polisher from China
Polishing machine for compound semiconductor wafers like gallium arsenide, bringing surfaces to mirror finish required for device fabrication per statistical note (a)(ii)(C). Fits HTS 8464.20.0120 for polishing machines working like mineral materials. Used after lapping to prepare wafers for photolithography.
Duty Rate — China → United States
39.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide material compatibility certificates for GaAs; declare as 'wafer polishing equipment' with statistical note reference; consider FTZ for high-value semiconductor tools