Concrete Wafer Polishing Machine from Mexico
High-precision polisher for engineered concrete wafer substrates in advanced power modules. HTS 8464.20.0120 covers concrete polishing machines. Alternative mineral substrate for SiC power semiconductors.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide concrete composition analysis; declare substrate thickness specs; check construction equipment tariffs