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8464.20.01.20/Concrete Wafer Polishing Machine/Japan

Concrete Wafer Polishing Machine from Japan

High-precision polisher for engineered concrete wafer substrates in advanced power modules. HTS 8464.20.0120 covers concrete polishing machines. Alternative mineral substrate for SiC power semiconductors.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Provide concrete composition analysis; declare substrate thickness specs; check construction equipment tariffs