Concrete Wafer Polishing Machine from Germany
High-precision polisher for engineered concrete wafer substrates in advanced power modules. HTS 8464.20.0120 covers concrete polishing machines. Alternative mineral substrate for SiC power semiconductors.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide concrete composition analysis; declare substrate thickness specs; check construction equipment tariffs