Concrete Wafer Polishing Machine from Germany
High-precision polisher for engineered concrete wafer substrates in advanced power modules. HTS 8464.20.0120 covers concrete polishing machines. Alternative mineral substrate for SiC power semiconductors.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide concrete composition analysis; declare substrate thickness specs; check construction equipment tariffs