Okuma Genos L3000 CNC Multi-Tasking Machine
A numerically controlled multi-tasking machine for complex metalworking including milling, turning, and punching for semiconductor crystal boule grinders. Classified in HTS 8462.90.4030 as other NC machine tools not specified elsewhere for forging, bending, or shearing metal. Provides versatility for high-precision parts in wafer manufacturing equipment.
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Alternative Classifications
This product could be classified differently depending on its characteristics or intended use.
If primarily for sawing or cutting operations
Sawing machines for metal, like wafer slicing saws, classify under 8461, separate from 8462 presses.
If for semiconductor processing equipment
Per statistical notes, crystal grinders/pullers for semiconductor materials fall under specific Chapter 84 provisions.
If not numerically controlled
Non-NC metalworking machine tools are in 8462.99, with potentially different duties.
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Import Tips & Compliance
• Submit FDA or cleanroom compatibility certifications if destined for semiconductor clean environments
• Document software versions and NC programming capabilities to validate HTS numerical control subheading
• Avoid common pitfalls by declaring full machine value including installed software and tooling
Related Products under HTS 8462.90.40.30
Haas VF-2 CNC Vertical Machining Center
A numerically controlled vertical machining center used for precision milling, drilling, and tapping of metal parts in semiconductor manufacturing equipment production. Classified under HTS 8462.90.4030 as a numerically controlled machine tool for metalworking operations like bending and punching in its 'other' category. It supports high-accuracy fabrication required for semiconductor processing tools.
DMG Mori NLX 2500 CNC Lathe
Numerically controlled precision lathe for turning metal components used in semiconductor wafer grinders and polishers. Falls under HTS 8462.90.4030 as an 'other' numerically controlled machine tool for metalworking processes including straightening and flattening. Essential for producing parts within tight tolerances for semiconductor fabrication equipment.
Mazak Integrex i-200S CNC Mill-Turn Center
Numerically controlled mill-turn center for producing intricate metal parts used in semiconductor wafer slicing saws and polishers. HTS 8462.90.4030 covers this as other NC machine tools for metal bending, folding, and punching operations. Enables simultaneous multi-axis machining for semiconductor equipment components.
Doosan Puma 2100 CNC Horizontal Lathe
CNC horizontal lathe numerically controlled for straightening and flattening metal shafts in crystal growers and pullers for semiconductor production. Falls under HTS 8462.90.4030 as other numerically controlled metalworking machine tools. Critical for achieving surface flatness in wafer preparation equipment.
Citizen Cincom M32 CNC Swiss-Type Lathe
Precision numerically controlled Swiss-type lathe for micro-machining metal components in semiconductor wafer lappers and polishers. Classified under HTS 8462.90.4030 for other NC machine tools performing punching and notching on metal. Ideal for sub-micron tolerance parts in wafer surface preparation.
Yamazaki Mazak Variaxis i-700 CNC 5-Axis Machining Center
5-axis numerically controlled machining center for complex metal components in semiconductor testing apparatus housings. HTS 8462.90.4030 as other NC tools for shearing and flattening metal parts. Enables intricate geometries for equipment used in device testing per statistical notes.