Other
Machine tools (including presses) for working metal by forging, hammering or die forging (excluding rolling mills); machine tools (including presses, slitting lines and cut-to-length lines) for working metal by bending, folding, straightening, flattening, shearing, punching, notching or nibbling (excluding drawbenches); presses for working metal or metal carbides, not specified above: > Other: > Numerically controlled > Other
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8462.90.40.30
Haas VF-2 CNC Vertical Machining Center
A numerically controlled vertical machining center used for precision milling, drilling, and tapping of metal parts in semiconductor manufacturing equipment production. Classified under HTS 8462.90.4030 as a numerically controlled machine tool for metalworking operations like bending and punching in its 'other' category. It supports high-accuracy fabrication required for semiconductor processing tools.
DMG Mori NLX 2500 CNC Lathe
Numerically controlled precision lathe for turning metal components used in semiconductor wafer grinders and polishers. Falls under HTS 8462.90.4030 as an 'other' numerically controlled machine tool for metalworking processes including straightening and flattening. Essential for producing parts within tight tolerances for semiconductor fabrication equipment.
Okuma Genos L3000 CNC Multi-Tasking Machine
A numerically controlled multi-tasking machine for complex metalworking including milling, turning, and punching for semiconductor crystal boule grinders. Classified in HTS 8462.90.4030 as other NC machine tools not specified elsewhere for forging, bending, or shearing metal. Provides versatility for high-precision parts in wafer manufacturing equipment.
Mazak Integrex i-200S CNC Mill-Turn Center
Numerically controlled mill-turn center for producing intricate metal parts used in semiconductor wafer slicing saws and polishers. HTS 8462.90.4030 covers this as other NC machine tools for metal bending, folding, and punching operations. Enables simultaneous multi-axis machining for semiconductor equipment components.
Doosan Puma 2100 CNC Horizontal Lathe
CNC horizontal lathe numerically controlled for straightening and flattening metal shafts in crystal growers and pullers for semiconductor production. Falls under HTS 8462.90.4030 as other numerically controlled metalworking machine tools. Critical for achieving surface flatness in wafer preparation equipment.
Citizen Cincom M32 CNC Swiss-Type Lathe
Precision numerically controlled Swiss-type lathe for micro-machining metal components in semiconductor wafer lappers and polishers. Classified under HTS 8462.90.4030 for other NC machine tools performing punching and notching on metal. Ideal for sub-micron tolerance parts in wafer surface preparation.
Yamazaki Mazak Variaxis i-700 CNC 5-Axis Machining Center
5-axis numerically controlled machining center for complex metal components in semiconductor testing apparatus housings. HTS 8462.90.4030 as other NC tools for shearing and flattening metal parts. Enables intricate geometries for equipment used in device testing per statistical notes.
Grob G350 CNC 5-Axis Universal Machining Center
Numerically controlled 5-axis universal machining center for producing metal housings and fixtures for semiconductor crystal pullers. Under HTS 8462.90.4030 as other NC machine tools for die forging and bending of metal. Supports Czochralski method equipment manufacturing.
Makino S33 Connect CNC Vertical Machining Center
High-speed numerically controlled vertical machining center for mold components used in semiconductor wafer grinder fabrication. HTS 8462.90.4030 covers other NC tools for punching and notching metal. Features IoT connectivity for precision semiconductor equipment production.
GF Machining Solutions Mikron HSM 500 CNC Mill
Numerically controlled high-speed milling machine for graphite electrodes and metal parts in semiconductor processing equipment. Classified HTS 8462.90.4030 as other NC metalworking tools for flattening and shearing. Used for electrode production in crystal growth systems.