Makino S33 Connect CNC Vertical Machining Center from Japan
High-speed numerically controlled vertical machining center for mold components used in semiconductor wafer grinder fabrication. HTS 8462.90.4030 covers other NC tools for punching and notching metal. Features IoT connectivity for precision semiconductor equipment production.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include network connectivity specs but classify based on metalworking function, not software
• Validate spindle taper and tool changer capacity against HTS tolerances
• Ensure proper packing for vibration-sensitive high-speed machining imports