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8461.90.60/Wafer Surface Lapper/Mexico

Wafer Surface Lapper from Mexico

Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.

Duty Rate — Mexico → United States

14.4%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Demonstrate removal rates proving machine tool function

• Use temporary importation for equipment evaluation