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8461.90.60/Wafer Surface Lapper/Japan

Wafer Surface Lapper from Japan

Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Demonstrate removal rates proving machine tool function

• Use temporary importation for equipment evaluation

Wafer Surface Lapper from Japan — Import Duty Rate | HTS 8461.90.60