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8461.90.60/Wafer Surface Lapper/Germany

Wafer Surface Lapper from Germany

Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Demonstrate removal rates proving machine tool function

• Use temporary importation for equipment evaluation

Wafer Surface Lapper from Germany — Import Duty Rate | HTS 8461.90.60