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8461.90.60/Wafer Surface Lapper/Canada

Wafer Surface Lapper from Canada

Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Demonstrate removal rates proving machine tool function

• Use temporary importation for equipment evaluation