Wafer Surface Lapper from Canada
Single-sided lapping machine that conditions wafer surfaces for epitaxial growth by removing saw damage and achieving parallelism. HTS 8461.90.60 classification per wafer preparation statistical provisions.
Duty Rate — Canada → United States
14.4%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Demonstrate removal rates proving machine tool function
• Use temporary importation for equipment evaluation