Wafer Edge Grinder from Mexico
Machine that grinds the edges of sliced semiconductor wafers to precise dimensions and removes damage from sawing. Classified under HTS 8461.90.60 as other wafer preparation equipment involving cermet material removal.
Duty Rate — Mexico → United States
14.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide wafer thickness tolerance data (typically <1mm) for classification support
• Check for preferential tariff treatment under USMCA for qualifying equipment