8461.90.60/Wafer Edge Grinder/Japan

Wafer Edge Grinder from Japan

Machine that grinds the edges of sliced semiconductor wafers to precise dimensions and removes damage from sawing. Classified under HTS 8461.90.60 as other wafer preparation equipment involving cermet material removal.

Duty Rate — Japan → United States

14.4%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide wafer thickness tolerance data (typically <1mm) for classification support

• Check for preferential tariff treatment under USMCA for qualifying equipment