Wafer Edge Grinder from Germany
Machine that grinds the edges of sliced semiconductor wafers to precise dimensions and removes damage from sawing. Classified under HTS 8461.90.60 as other wafer preparation equipment involving cermet material removal.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide wafer thickness tolerance data (typically <1mm) for classification support
• Check for preferential tariff treatment under USMCA for qualifying equipment