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8461.90.60/Wafer Edge Grinder/Canada

Wafer Edge Grinder from Canada

Machine that grinds the edges of sliced semiconductor wafers to precise dimensions and removes damage from sawing. Classified under HTS 8461.90.60 as other wafer preparation equipment involving cermet material removal.

Duty Rate — Canada → United States

14.4%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Provide wafer thickness tolerance data (typically <1mm) for classification support

• Check for preferential tariff treatment under USMCA for qualifying equipment

Wafer Edge Grinder from Canada — Import Duty Rate | HTS 8461.90.60