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8461.90.60/Stress Relief Wafer Grinder/Japan

Stress Relief Wafer Grinder from Japan

Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include stress measurement validation data in support docs

• Bundle with metrology tools under single entry

Stress Relief Wafer Grinder from Japan — Import Duty Rate | HTS 8461.90.60