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8461.90.60/Stress Relief Wafer Grinder/China

Stress Relief Wafer Grinder from China

Grinds wafer edges to remove stress-induced microcracks from slicing, preventing breakage in later processing. Specialized semiconductor grinder under HTS 8461.90.60 per statistical notes.

Duty Rate — China → United States

41.9%

Rate breakdown

9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
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Import Tips

• Include stress measurement validation data in support docs

• Bundle with metrology tools under single entry

Stress Relief Wafer Grinder from China — Import Duty Rate | HTS 8461.90.60